With the significant increase in demand for automotive wafers, an increasing number of analog devices are being upgraded from consumer-grade to automotive-grade. Due to the strict quality management requirements in the automotive industry, the enhanced reliability requirements have led to a growing demand for three-temperature testing of wafers (ranging from -40°C to 125°C).

For power management chips, some wafers require not only the three-temperature CP (Circuit Probing) testing but also trimming, and most of them need True Kelvin CP testing. Under the premise of not modifying the wafer layout (which is advantageous in terms of cost, and beneficial for earlier mass production of automotive-grade chips), traditional cantilever probe cards can no longer meet the requirements.

This poses extremely high requirements for wafer CP (Circuit Probing) test probe cards, with challenges that are no less than those faced by 2D MEMS probe card with tens of thousands of pins used for SoC (System on Chip) chips.

UIGreen is the first domestic provider of MEMS probe card solutions to achieve mass production of True Kelvin CP Test on an 80×80 um PAD size. The probe marks of the MEMS probe cards at the client site are as follows, with an extreme dual-needle gap of 15 um.

Tel | 0512-87176308Email | Sales@afangroup.comAddress | 80# Emeishan Road, 196# Putuoshan Road, New District Suzhou,Jiangsu, China (215163)